diálogos ELE

JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. Japan Electronics and Information Technology Industries Association (JEITA) Standards EIAJ ED/ Environmental and endurance test methods for. EIAJ ED/ Test Method Ta=85°C, 85%RH, Vcc=80V, Vdd=6V. hrs. 0/ AC. EIAJ ED B Ta=°C,%RH.

Author: Nikoramar Shataur
Country: Malaysia
Language: English (Spanish)
Genre: Science
Published (Last): 18 July 2006
Pages: 133
PDF File Size: 5.83 Mb
ePub File Size: 4.25 Mb
ISBN: 542-8-55110-440-6
Downloads: 19480
Price: Free* [*Free Regsitration Required]
Uploader: Grojora

A new and old classification method is shown in Comment Table 1. However, the reader can consider the data that we shall present below. Individual specifications on each test methods had been proposed in considering process, but this proposal was not realized. In particular, utmost attention should be paid to the precautions indicated in the detail specifications.

No part of this standards may be reproduced in any form or by any means without prior permission in writing from the publisher. The junction temperature of the specimen. When evaluating semiconductor devices, in addition to the electrical and mechanical specifications and performance, reliability is another important factor.

Example, too many times and a few mistaking between the newest version and old version. When the specimen has outward appearance different from those ones shown in the figures, its directions are defined in the relevant specifications. Climatic test methods C: The semiconductor devices that are made with the object of being mounted on printed circuit boards by means of the surface mounting method. Below are listed the members of deliberation of this standard.

The ambient temperature when the specimen is stored in inoperative state. In other words, from the above reliability data we can see that the ROHM SiC-SBDs subjected to evaluations have demonstrated satisfactory reliability in the familiar same tests used for reliability testing of Si transistors and ICs.


The temperature on the surface of the specimen at the point specified in the relevant specifications. The equipment used to test the specimens. Toru Katou Sanyo Electric Co.

The final revision planing was decided to above-mentioned 6 separate volumes. Portable appliance testing wikipedialookup Electromagnetic compatibility wikipedialookup Semiconductor device wikipedialookup. In particular, power devices are intended to handle large amounts of power, and so must attain satisfactory reliability.

Osamu Nakayama Kawasaki Microelectronics, Inc. JEITA ED is a standard for “environmental and endurance test methods for semiconductor devices”, and describes testing methods for evaluating semiconductor devices for industry and consumers. Reliability of SiC-SBDs Because SiC does not have a long history as a semiconductor material, and because it does not have much of a track record compared with Si power devices, there may not be much awareness of the level of its reliability.

Toshiki Yamaguchi Fujitsu Ltd. Back to the main subject. The visual inspection and the electrical and optical measurements that are carried out after finishing the tests. This standard is widely adopted in Japan. Hence there are concerns about the possibility of a similar failure mode. Nobuyuki Kawayoshi Sharp Corp. The temperature at the reference point specified in the relevant specifications.

Standards Related to Reliability Test |Sanken Electric

There is a tendency for people to be hesitating over things that are new and untested. The temperature of the air at a place separated by a distance sufficient to neglect the influence of the heat radiation from the specimen, when it is cooled by natural convection. JEITA assumes absolutely no responsibility toward parties applying these standards or toward patent owners. The sequence according to which the various kinds of treatments, measurements, conditionings, inspections, etc.


Because SiC does not have a long history as a semiconductor material, and because it does not have much of a track record compared with Si power devices, there may not be much awareness of the level of its reliability.

Reliability Evaluation Fee

What are SiC Schottky barrier diodes? But in SiC-SBDs, the occurrence of such failure is regarded as unlikely because the recovery current is extremely small. The standards related to integrated circuits IC and separate volume Appendix had been published, and the standards related to discrete devices SD separate volume Appendix and separate volume Appendix had been published.

Indicates the value under ordinary operating conditions. Masashi Kusuda Mitsumi Electric Co. The materials used to test the specimens.

Takahiro Ito Rohm Co. Atsushi Natsume Sony Corp.

Main revision points are as follow. Moreover, during the electrical measurements, the measurement conditions should not exceed the maximum ratings. The life tests and the strength tests was subdivided according to the revision frequency.

The visual inspection and the electrical and optical measurements which the specimens are submitted to in the first place before carrying out the tests. Hiroyoshi Odaira Seiko Epson Corp. Anyone who has studied the reliability of semiconductor devices and has actually eiwj evaluations will probably be familiar with these standards and conditions. Tetsuji Matsuura Toshiba Corp.

SiC Power Device

The 4 Appendixes confused the newest specification searching. This website uses cookies. Kohki Ohara Ricoh Co. Semiconductor device wikipedialookup.